Thursday, May 19, 2011

Evaluation of PDK in semi conductor industry

     Process Design Kit (PDK) is the interface between semiconductor design tools and the semiconductor manufacturing process. For each new process we need to bring up PDK. Initially PDK referred to a PCELL library supplied by a foundry. PDK’s eventually grown to include all design elements, docs etc related technology which ever necessary for IC design.


     Contents of PDK: Manufacturing design rules, electrical design rules and DRC, LVS run set files to verify physical & electrical layout for various EDA tools. Schematic symbol libraries. Various kinds of simulation models. Parasitic extraction rules. Description of basic building blocks of the process and are expressed algorithmically as Parameterized cells (PCells). Call backs to execute, evaluate and update when changes to parameters. Schematic symbols, PCells and callbacks are linked via a Component Description Format (CDF). Layer map file & technology file for layout Editors.

      Essence of iPDK: PDK’s were specific to EDA vendors, specific to foundry, tech node & process variant. With more number of tools & more number of processes it’s became a very difficult situation for qualifying PDK’s to all combinations. So Interoperable PDK Libraries Alliance (IPL) working with TSMC explored the possibility of interoperable PDK’s (iPDK), PDK that can supports different EDA tools.

     Need of common database: To get iPDK it’s important to have a common data base for EDA companies. To interoperate without data conversion and loss of functionality in between any two different EDA tools. A standard database Open Access (OA) created by cadence and given to the Silicon Integration Initiative (Si2) for standards organization.

     Need of common scripting language: PCell coding for iPDK, there is a necessary of interoperable scripting language. The OA standard features plug-ins for many of standard scripting languages like Tcl, C++ and Python. Ciranova created OA based Python PCells called PyCells.

     Why Python? Python supports OOPs. Faster run times. PyCell code has fewer lines as compared to PCell code. It also supports features like abutment, stretch handles and DFM rules. Efficient PyCell debugging to shortening cycle times.
     
iPDK is seen as TSMC standard. But other foundries wont support it.  They only support virtuoso PDK. Si2 has started a new effort to develop Open Process Design Kit (Open PDK). The goal of Open PDK is to define a set of open standards to allow a PDK to be portable across foundries and EDA tools.

Wednesday, May 18, 2011

12 Social Networking Services

Now a days social networks became a part of every one's life.
Here you can find 12 social network to stay in connection with your family, friends &  colleagues.
See the slide show in below link for more details : 12 Social Networks





Monday, May 16, 2011

Crossing the barriers: Through Silicon Via (TSV)

Through Silicon via (TSV) technology is a 3D integration of multiple dies into a single stack to transfer data among the dies.

TSV is composed of a conductor, crossing the Si Subtrate of the stacked dies. This conductor is electrically insulated from the substrate by a dielectric and connects the metal wires of the stacked dies.

Cross Section of TSV:

Advantages of TSV technology:
TSV technology uses vertical interconnections (where as 2D IC's use only horizental interconnects). As it use small area of 3D ICS's leading to shorter wirelength than 2D IC's because gates can be placed on top of each other in different dies, eliminating the need of long chip interconnects existing in 2-D IC's.
  • Greater density for the same footprint
  • More functionality
  • Higher performance
  • Lower power consumption
  • Lower cost
  • More manufacturing flexibility
  • Faster time to market


TSV among different dies:

Thursday, May 12, 2011

EDA Tools from various vendors to check DRC

EDA Vendors
ToolVendor Features
Calibre nmDRC Mentor Graphics Hierarchical DRC, multi-core, gold standard at many foundries
Calibre Pattern Matching Mentor Graphics DRC+ graphical input, multi-core, supports Globalfoundries 28nm node
Calibre InRoute Mentor Graphics DRC and DFM while doing P&R with Olympus
Calibre RealTimeMentor Graphics
DRC inside of IC layout editors
HerculesSynopsys Hierarchical, for 45nm nodes and larger
IC ValidatorSynopsys Hierarchical, for 45nm nodes and smaller, validated at 40nm nodes, multi-core, integrates with IC Compiler
IC CompilerSynopsysDRC and DFM with IC Validator while doing P&R with IC Compiler
PVSCadence Multi-core
In-Design PVS Cadence Multi-core, integrates with P&R and Custom IC layout editor
Quartz DRCMagma Multi-core, Quartz DRC GUI, integration with Talus® Vortex allows for in-the-loop incremental DRC
Talus qDRC Magma Integration with Talus® Vortex allows for in-the-loop incremental DRC
HiPer VerifyTanner EDALower cost, DRC for AMS designs, reads decks from: Calibre, Assura, Dracula
PowerDRCPolytedaFlat full-chip DRC, multi-core